ASQ - Electronics and Communications Division

Modeling Damage in Large and Heavy Electronic Components Due to Dynamic Loading

Abstract: 2011 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must first be obtained from the IEEE.

The performance of the next-generation U.S. Army platforms, such as the Small Unmanned Ground Vehicles (SUGV) and Small Unmanned Arial Vehicles (SUAV), is strongly dependent on electronics. These electronic systems may experience harsh dynamic loads due to shock and vibration. These loads may cause significant damage to electronic component packages, leads and solder joints. The damage can be due to a combination of bending moments in Printed Circuit Boards (PCBs) and/or inertias of large/heavy components. When modeling a PCB, the typical approach in electronics Physics of Failure (PoF) is to employ a two- dimensional (2-D) finite element analysis (FEA) which uses the “smeared” properties technique. Such an approach may not fully address the inertias of large/heavy components and their local stiffness.

Keywords: Failure Analysis - Failure Rate - Quality Assurance - RAMS 2011 Proceedings - Reliability Analysis/Prediction/Estimation - Reliability Model

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