Modeling Damage in Large and Heavy Electronic Components Due to Dynamic Loading
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The performance of the next-generation U.S. Army platforms, such as the Small Unmanned Ground Vehicles (SUGV) and Small Unmanned Arial Vehicles (SUAV), is strongly dependent on electronics. These electronic systems may experience harsh dynamic loads due to shock and vibration. These loads may cause significant damage to electronic component packages, leads and solder joints. The damage can be due to a combination of bending moments in Printed Circuit Boards (PCBs) and/or inertias of large/heavy components. When modeling a PCB, the typical approach in electronics Physics of Failure (PoF) is to employ a two- dimensional (2-D) finite element analysis (FEA) which uses the “smeared” properties technique. Such an approach may not fully address the inertias of large/heavy components and their local stiffness.
Keywords: Failure Analysis - Failure Rate - Quality Assurance - RAMS 2011 Proceedings - Reliability Analysis/Prediction/Estimation - Reliability Model